Ho₂Cu₂Si₂ is an intermetallic compound combining holmium (a rare-earth element), copper, and silicon in a defined stoichiometric ratio. This material belongs to the family of rare-earth-based intermetallics and is primarily of research and exploratory interest rather than established industrial production. Potential applications leverage rare-earth magnetism and the thermal/electrical properties of copper-silicon intermetallics, with investigation focused on magneto-thermal effects, magnetic refrigeration systems, and specialized electronic materials where the coupling of rare-earth magnetic moments with metallic conductivity offers advantages over conventional alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00470 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.6700 | eV/atom | — |