Ho₁Pa₁Os₂ is an experimental ternary intermetallic compound combining holmium, palladium, and osmium elements, classified as a semiconductor. This material belongs to the family of rare-earth transition-metal compounds, which are primarily of research interest rather than established industrial materials. The compound's potential applications lie in thermoelectric devices, high-temperature electronics, or catalytic systems where the combined properties of rare-earth and refractory metals may offer advantages, though such materials typically require further development and characterization before practical deployment.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 165.6 | GPa | — | ||
Shear Modulus(G) | 10.62 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00680 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3560 | eV/atom | — |