Ho₁Cu₄Pd₁ is an intermetallic compound combining holmium (a rare earth element), copper, and palladium in a fixed stoichiometric ratio. This material belongs to the family of rare-earth transition metal intermetallics, which are primarily investigated in research settings for their potential in magnetic, electronic, and catalytic applications. The combination of holmium's magnetic properties with the electronic characteristics of copper and palladium makes this compound of interest in materials science research, though industrial-scale applications remain limited and the material is not commonly encountered in mainstream engineering practice.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00860 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3920 | eV/atom | — |