Ho1Cu1 is an intermetallic compound composed of holmium and copper in a 1:1 atomic ratio, belonging to the semiconductor class of materials. This rare-earth copper intermetallic is primarily of research interest, studied for its electronic and magnetic properties that arise from the combination of a lanthanide element with a transition metal. While not yet established in high-volume industrial applications, materials in this family are investigated for potential use in specialized electronic devices, magnetic systems, and high-performance functional materials where rare-earth interactions with transition metals can be exploited.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 77.47 | GPa | — | ||
Shear Modulus(G) | 37.24 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00900 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3280 | eV/atom | — |