Hg1Pd2Au1 is an intermetallic compound combining mercury, palladium, and gold in a fixed stoichiometric ratio, classified as a semiconductor. This material represents a research-phase alloy within the precious metal intermetallic family, combining the catalytic and electronic properties of palladium and gold with mercury's unique bonding characteristics. Such ternary systems are primarily investigated for specialized applications requiring controlled electronic behavior, corrosion resistance, and catalytic activity rather than for structural applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 138.9 | GPa | — | ||
Shear Modulus(G) | 40.00 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01590 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1470 | eV/atom | — |