HfBO2N is a hafnium-based oxynitride ceramic compound combining hafnium, boron, oxygen, and nitrogen elements. This material belongs to the family of advanced refractory and wide-bandgap semiconductors, primarily explored in research contexts for high-temperature and high-power electronic applications. The incorporation of boron and nitrogen into hafnium oxide creates a material with potential for improved thermal stability, hardness, and electrical properties compared to conventional hafnium oxide, making it of interest for next-generation semiconductor devices and protective coatings in extreme environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 2.600 | eV | — | ||
Magnetic Moment(μB) | -0.000459 | μB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 1.060 | eV/atom | — |