Hf1Cu1P1 is an intermetallic compound combining hafnium, copper, and phosphorus in a 1:1:1 stoichiometry. This is a research-phase material belonging to the ternary intermetallic family; such compounds are primarily investigated for electronic and structural applications where the combination of refractory (hafnium) and conductive (copper) elements with phosphorus may offer unique electronic properties. While not yet established in high-volume production, hafnium-copper-phosphorus phases are of interest in materials research for potential semiconductor, thermoelectric, or advanced functional coating applications where unconventional electronic structures could provide advantages over conventional binary alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 10,992.3 | ksi | — | ||
Shear Modulus(G) | 2,052.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01620 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1200 | eV/atom | — |