Epoxy is a thermosetting polymer formed by cross-linking epoxide resin with hardeners, creating a rigid, highly networked structure that does not soften upon heating. It is widely used in structural adhesives, composite matrices (fiber-reinforced polymers), protective coatings, and electrical encapsulation due to its excellent adhesion, chemical resistance, and dimensional stability. Engineers select epoxy over other polymers when high stiffness, low creep, superior bond strength, and reliable performance in harsh chemical or thermal environments are required, though its brittle nature and moisture sensitivity require careful design consideration.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Compressive Strength(σc) | 84.10 | MPa | — | ||
Elongation at Break(εf) | 5.174 | - | — | ||
Flexural Strength (MOR)(σf) | 104.6 | MPa | — | ||
Hardness (Vickers)(HV) | 209.2 | HV | — | ||
Ultimate Tensile Strength(σUTS) | 56.41 | MPa | — | ||
Young's Modulus(E) | 2.471 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Glass Transition Temperature(Tg) | 390.6 | K | — | ||
Melting Point / Solidus(Tm) | 408.8 | K | — | ||
Maximum Service Temperature(Tmax) | 619.4 | K | — | ||
Thermal Conductivity(k) | 0.8619 | W/(m·K) | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 3.270 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Refractive Index(n) | 1.521 | - | — |