CuTeSCl

metal
· JVASP-147024· CuTeSCl

CuTeSCl is a copper-based mixed-anion compound containing tellurium, sulfur, and chlorine elements, representing a rare quaternary metal compound with potential semiconductor or solid-state chemistry applications. This material appears to be primarily research-oriented rather than established in mainstream industrial production, belonging to a family of chalcogenide and halide compounds that are investigated for optoelectronic, thermoelectric, or photovoltaic properties. The unique combination of copper with multiple anion types suggests potential relevance in exploratory materials science for niche electronic or photonic device architectures.

experimental semiconductorschalcogenide researchsolid-state electronicsphotovoltaic materials (research phase)thermoelectric compounds

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
eV
Magnetic Moment(μB)
µB
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
eV/atom
Formation Energy(ΔHf)
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.