CuTeSCl is a copper-based mixed-anion compound containing tellurium, sulfur, and chlorine elements, representing a rare quaternary metal compound with potential semiconductor or solid-state chemistry applications. This material appears to be primarily research-oriented rather than established in mainstream industrial production, belonging to a family of chalcogenide and halide compounds that are investigated for optoelectronic, thermoelectric, or photovoltaic properties. The unique combination of copper with multiple anion types suggests potential relevance in exploratory materials science for niche electronic or photonic device architectures.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.406 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 1.038 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.3268 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data