Copper sulfate (CuSO₄) is an inorganic crystalline compound that exists in anhydrous and hydrated forms, classified as a ceramic/salt material with ionic bonding. It is widely used in electroplating, metal surface treatment, and as a precursor for copper-based materials in industrial chemistry. The material is valued in agricultural applications as a fungicide and algicide, in laboratory settings for chemical analysis and demonstrations, and historically in printed circuit board manufacturing; its primary advantage over alternatives is the combination of cost-effectiveness, availability, and the ability to provide controlled copper ion sources in aqueous solutions.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.830 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.000376 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.000337 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -32.00 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | -28.71 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf)2 entries | -1.095 | eV/atom | DFT · OptB88vdW | ||
| ↳ | -1.330 | eV/atom | Measured |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data