Copper sulfate (CuSO₄) is an inorganic crystalline compound that exists in anhydrous and hydrated forms, classified as a ceramic/salt material with ionic bonding. It is widely used in electroplating, metal surface treatment, and as a precursor for copper-based materials in industrial chemistry. The material is valued in agricultural applications as a fungicide and algicide, in laboratory settings for chemical analysis and demonstrations, and historically in printed circuit board manufacturing; its primary advantage over alternatives is the combination of cost-effectiveness, availability, and the ability to provide controlled copper ion sources in aqueous solutions.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.830 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Seebeck Coefficient(S) | -32.00 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -1.330 | eV/atom | — | ||
| ↳ | -1.095 | eV/atom | — |