CuSnAu is a ternary copper-tin-gold alloy that combines the corrosion resistance and workability of copper with tin's strengthening effects and gold's nobility. This material class is primarily used in high-reliability electrical contacts, connectors, and decorative applications where corrosion resistance, wear resistance, and aesthetic properties are critical; the gold component ensures oxidation resistance while maintaining cost-effectiveness compared to pure gold systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.4040 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01620 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.09977 | eV/atom | — |