CuSi₂P₃ is a copper-silicon-phosphorus intermetallic compound that belongs to the family of phosphide-based metallic materials. This ternary phase combines the thermal and electrical properties characteristic of copper-based systems with the structural contributions of silicon and phosphorus, making it a research-stage material of interest for specialized metallurgical applications. The material's low density relative to many intermetallics and its potential for enhanced hardness and thermal stability suggest applications in environments requiring lightweight metallic components with improved wear or corrosion resistance, though industrial adoption remains limited pending further development and characterization.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1154 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.09320 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.03701 | eV/atom | — |