CuScN3

metal

· CuScN3

CuScN3 is a ternary nitride compound combining copper, scandium, and nitrogen—a research-phase material exploring intermetallic and ceramic compound space rather than a production engineering alloy. This material family is investigated for potential applications requiring high hardness, thermal stability, or specialized electronic properties, though industrial adoption remains limited and the material is primarily found in academic and exploratory materials research settings.

hard coatings (research phase)high-temperature ceramics (exploratory)thin-film applicationsmaterials researchadvanced compound development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

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Method

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	DFT · GLLB-SC
Magnetic Moment(μB)	-0.000618	μB	DFT

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	2.240	eV/atom	DFT

Verified Unverified Low confidence (<80%) Link to source

Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

CuScN3 — Properties & Data | MatWorld

CuScN3

Electrical Properties

Other Properties

Regulatory Screening

Environmental

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