CuSbPd2 is an intermetallic compound combining copper, antimony, and palladium in a defined stoichiometric ratio. This is a research-stage material rather than a widely commercialized alloy; intermetallic compounds of this type are investigated for specialized applications where controlled crystal structure and intermediate mechanical properties between pure metals are advantageous. The copper-palladium-antimony system belongs to a family of materials explored for thermoelectric, catalytic, and wear-resistant applications where the combination of transition metals offers tunable electronic and mechanical characteristics unavailable in conventional monolithic alloys.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 649.8 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.2700 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 398.9 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.03262 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.2680 | eV | DFT · OptB88vdW | ||
High-Frequency Dielectric Constant (ε∞)(ε∞) | 5.088 | - | DFT · OptB88vdW | ||
Electron Effective Mass(m*e) | 0.08333 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 0.08333 | me | DFT · OptB88vdW · 27°C | ||
Magnetic Moment(μB) | 0.01500 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.000367 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.000370 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -193.4 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | -176 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 2.227 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 1.930 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data