CuPN2 is a copper-based intermetallic compound containing phosphorus and nitrogen, belonging to the family of copper nitrides and phosphides that exhibit high hardness and thermal stability. This material is primarily of research and development interest for applications requiring wear resistance, corrosion protection, or hard coatings; it represents an emerging alternative to traditional hard metals and ceramics where copper's inherent properties—such as electrical and thermal conductivity combined with antimicrobial character—offer added functionality beyond hardness alone.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 208.5 | GPa | — | ||
Poisson's Ratio(ν) | 0.2900 | - | — | ||
Shear Modulus(G) | 105.9 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.208 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 2.081 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2126 | eV/atom | — |