CuPd3 is an intermetallic compound composed of copper and palladium, forming an ordered crystalline phase with high density suitable for specialized applications requiring corrosion resistance and catalytic properties. This material belongs to the copper-palladium binary system and is primarily of research and industrial interest in catalysis, electronic packaging, and thin-film technologies where the combination of copper's conductivity and palladium's catalytic and barrier properties offers functional advantages over single-element alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3946 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01790 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.06177 | eV/atom | — |