CuNi3N is a copper-nickel nitride intermetallic compound that combines metallic and ceramic characteristics through nitrogen incorporation into the Cu-Ni system. This material is primarily of research interest in advanced materials development, where nitride-based metallics are investigated for applications requiring enhanced hardness, wear resistance, and thermal stability compared to conventional binary copper-nickel alloys. While not yet widely established in mainstream production, compounds in this family are explored for surface coatings, wear-resistant components, and high-performance applications where the hardening effect of nitrogen can improve performance over unreinforced metal matrices.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.017 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 1.720 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.04933 | eV/atom | — |