CuNi3 is a copper-nickel intermetallic compound representing a specific stoichiometric phase in the Cu-Ni binary system. This material combines copper's thermal and electrical conductivity with nickel's strength and corrosion resistance, making it relevant for applications requiring balanced performance across thermal, mechanical, and environmental durability criteria. The ordered intermetallic structure typically offers improved hardness and creep resistance compared to conventional copper-nickel alloys, though with trade-offs in ductility that engineers must evaluate for their specific processing and service requirements.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3284 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 1.302 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02370 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.02136 | eV/atom | — |