CuNi2Sb is a copper-nickel-antimony intermetallic compound belonging to the family of ternary metal alloys. This material combines copper and nickel with antimony addition, creating a brittle intermetallic phase that exhibits potential applications in thermoelectric energy conversion and electronic device manufacturing, where specific electrical and thermal transport properties are exploited. The antimony-containing copper-nickel system is of research interest for semiconductor and thermoelectric applications, though it remains less common in mainstream industrial production compared to binary copper-nickel alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.245 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -2.640 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.07220 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.04923 | eV/atom | — |