CuN

metal
· JVASP-90849· CuN

Copper nitride (CuN) is an intermetallic compound combining copper with nitrogen, forming a ceramic-like metal nitride material. It is primarily of research and developmental interest rather than established in high-volume industrial production, with potential applications in hard coatings, wear-resistant surfaces, and semiconductor-related technologies where the combination of copper's electrical properties with nitrogen's hardening effects offers unique advantages. Engineers consider CuN for specialized applications requiring enhanced hardness and corrosion resistance in thin-film or coating form, though commercial adoption remains limited compared to more established nitride systems like TiN or CrN.

hard coatings and wear resistanceresearch and developmentsemiconductor processingcorrosion-resistant surfacesthin-film applications

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Bulk Modulus(K)
198.6
GPa
Poisson's Ratio(ν)
0.4600
-
Shear Modulus(G)
33.50
GPa
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Density(ρ)
5.891
kg/m³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
0.000
eV
Magnetic Moment(μB)
0.000
µB
Seebeck Coefficient(S)
5.490
µV/K
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
0.3249
eV/atom
Formation Energy(ΔHf)
0.3171
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.