Copper nitride (CuN) is an intermetallic compound combining copper with nitrogen, forming a ceramic-like metal nitride material. It is primarily of research and developmental interest rather than established in high-volume industrial production, with potential applications in hard coatings, wear-resistant surfaces, and semiconductor-related technologies where the combination of copper's electrical properties with nitrogen's hardening effects offers unique advantages. Engineers consider CuN for specialized applications requiring enhanced hardness and corrosion resistance in thin-film or coating form, though commercial adoption remains limited compared to more established nitride systems like TiN or CrN.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 198.6 | GPa | — | ||
Poisson's Ratio(ν) | 0.4600 | - | — | ||
Shear Modulus(G) | 33.50 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.891 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 5.490 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3249 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.3171 | eV/atom | — |