Copper nitride (CuN) is an intermetallic compound combining copper with nitrogen, forming a ceramic-like metal nitride material. It is primarily of research and developmental interest rather than established in high-volume industrial production, with potential applications in hard coatings, wear-resistant surfaces, and semiconductor-related technologies where the combination of copper's electrical properties with nitrogen's hardening effects offers unique advantages. Engineers consider CuN for specialized applications requiring enhanced hardness and corrosion resistance in thin-film or coating form, though commercial adoption remains limited compared to more established nitride systems like TiN or CrN.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 198.6 | GPa | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.4600 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 33.50 | GPa | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.891 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3249 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.3171 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data