CuI4

metal

· JVASP-8770· CuI4

CuI4 is an intermetallic compound composed of copper and iodine, belonging to the family of copper halides. This material exists primarily in research and specialized contexts rather than mainstream industrial production, as copper iodide compounds are investigated for potential applications in semiconductor and photonic technologies where their electronic and optical properties may offer advantages in niche applications.

semiconductor researchphotovoltaic materialsoptoelectronic devicesexperimental thin filmsmaterials science researchhalide compound studies

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions
Bulk Modulus(K)	2,916.7	ksi	—
Poisson's Ratio(ν)	0.3600	-	—
Shear Modulus(G)	1,318.4	ksi	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Density(ρ)	0.1874	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—
Seebeck Coefficient(S)	49.79	µV/K	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.01940	eV/atom	—
Formation Energy(ΔHf)	-0.04161	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

CuI4

Mechanical Properties

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control