Copper(II) chloride (CuCl2) is an inorganic ionic compound and metal halide that exists primarily as a dihydrate in industrial applications. It serves as a precursor material and process chemical in electrochemistry, metallurgy, and organic synthesis rather than as a structural engineering material. The compound is valued in industries including printed circuit board fabrication (copper etching), water treatment, photography, and wood preservation, where its strong oxidizing properties and copper ion availability make it the preferred choice over alternative chloride salts.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 4,069.8 | ksi | — | ||
Poisson's Ratio(ν) | 0.2900 | - | — | ||
Shear Modulus(G) | 1,985.6 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1344 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.9770 | µB | — | ||
Seebeck Coefficient(S) | 6.523 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03620 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.7112 | eV/atom | — | ||
| ↳ | -0.4931 | eV/atom | — |