CuBSe2 is a ternary compound combining copper, boron, and selenium elements, belonging to the family of semiconducting chalcogenides with potential thermoelectric or optoelectronic properties. This material remains primarily in the research and development phase rather than established industrial production, with interest driven by its potential for energy conversion applications or advanced semiconductor devices where the unique combination of constituent elements offers tunable electronic characteristics.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.585 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 1.617 | eV | DFT · OptB88vdW | ||
| ↳ | 1.983 | eV | DFT · TBmBJ | ||
Dielectric Constant (Relative Permittivity)(εr) | 10.44 range 10.03–10.85median of 2 measurements | - | DFT · PBEsol | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 9.497 | - | DFT · OptB88vdW | ||
| ↳ | 8.130 | - | DFT · TBmBJ | ||
Electron Effective Mass(m*e) | 0.5733 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 0.7033 | me | DFT · OptB88vdW · 27°C | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.00155 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.00218 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -167.4 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 270.3 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 23.37 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.1182 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data