CuAu is an intermetallic compound combining copper and gold, forming an ordered metallic phase with distinct crystallographic structure and mechanical properties distinct from simple solid solutions. This material is primarily of research and specialized industrial interest, valued in applications requiring the combined properties of both noble metals—such as high electrical and thermal conductivity paired with corrosion resistance and aesthetic appeal. CuAu's use is limited compared to conventional alloys due to cost and processing complexity, but it appears in precision electronics, jewelry alloys, and thin-film research where the gold content provides chemical stability and the copper enhances mechanical performance.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 134.9 | GPa | — | ||
| ↳ | 134.9 | GPa | — | ||
| ↳ | 141.9 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 4.313 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν)2 entries | 0.4020 | - | — | ||
| ↳ | 0.4100 | - | — | ||
Shear Modulus(G)3 entries | 28.28 | GPa | — | ||
| ↳ | 28.28 | GPa | — | ||
| ↳ | 34.21 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 14.41 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -10.22 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000100 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.05108 | eV/atom | — |