CuAgN3 is a copper-silver nitride compound representing an experimental intermetallic or ceramic material combining two noble metals with nitrogen. This material family is primarily of academic and research interest, investigated for potential applications requiring high electrical and thermal conductivity combined with chemical stability, though industrial adoption remains limited. Engineering interest centers on understanding how alloying copper and silver with nitrogen affects mechanical properties, oxidation resistance, and electrical performance compared to conventional copper or silver alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.00652 | μB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | 2.040 | eV/atom | — |