CuAgF3 is an intermetallic compound combining copper, silver, and fluorine, representing an experimental material composition not yet widely established in production engineering. Research into ternary copper-silver-fluorine systems has focused on exploring novel material combinations for potential applications in functional ceramics, solid-state electronics, and corrosion-resistant coatings, though practical industrial adoption remains limited and largely driven by materials science investigation rather than established engineering demand.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 14,110.7 | ksi | — | ||
Poisson's Ratio(ν) | 0.4200 | - | — | ||
Shear Modulus(G) | 2,719.5 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2197 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 1.560 | µB | — | ||
Seebeck Coefficient(S) | -9.407 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -1.412 | eV/atom | — |