Cu6PdN2 is an intermetallic compound combining copper and palladium with nitrogen, belonging to the family of transition metal nitrides and palladium-copper alloys. This material is primarily of research interest rather than established industrial production, explored for its potential in catalysis, wear-resistant coatings, and advanced functional applications that exploit the combined properties of palladium's catalytic activity and copper's thermal/electrical conductivity. Its notable characteristics stem from the strong metal-nitrogen bonding and the synergistic effects of copper-palladium combinations, making it a candidate for next-generation materials in catalytic systems and protective surface treatments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2707 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1909 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.1417 | eV/atom | — |