Cu6 Sn2

semiconductor

· Cu6 Sn2

Cu6Sn2 is an intermetallic compound from the copper-tin system, representing a specific stoichiometric phase that forms in copper-tin alloys and solders. This phase is significant in electronics packaging and solder metallurgy, where it appears as a reaction product at copper-solder interfaces; it is particularly relevant in lead-free solder systems where tin-based compositions interact with copper substrates and components. Engineers encounter this phase in reliability assessments of solder joints, as its formation and growth can influence mechanical strength, thermal cycling resistance, and long-term joint integrity in demanding applications.

electronics solder jointslead-free solder systemscopper-substrate interfacesthermal fatigue resistancemicroelectronic packagingintermetallic phase control

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.01480	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.02600	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu6 Sn2

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control