Cu4SnP10
metal· Cu4SnP10
Cu4SnP10 is a quaternary copper-tin-phosphorus intermetallic compound that combines copper's excellent electrical and thermal conductivity with tin and phosphorus alloying elements to modify strength and phase stability. This material belongs to the family of copper-based intermetallics and is primarily of research and developmental interest rather than established in high-volume production; its potential applications center on electrical contacts, thermal management components, and specialty alloy development where the specific combination of copper's conductive properties with enhanced mechanical performance from tin and phosphorus is advantageous.
electrical contacts and connectorsthermal management devicesintermetallic research materialscopper alloy developmenthigh-temperature electrical applications
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | — | lb/in³ | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — | |
Dielectric Constant (Relative Permittivity)(εr) | — median of 2 measurements | - | — | — | |
Magnetic Moment(μB) | — | µB | — | — | |
Seebeck Coefficient(S) | — | µV/K | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | — | eV/atom | — | — | |
Formation Energy(ΔHf) | — | eV/atom | — | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.