Cu4SnP10 is a quaternary copper-tin-phosphorus intermetallic compound that combines copper's excellent electrical and thermal conductivity with tin and phosphorus alloying elements to modify strength and phase stability. This material belongs to the family of copper-based intermetallics and is primarily of research and developmental interest rather than established in high-volume production; its potential applications center on electrical contacts, thermal management components, and specialty alloy development where the specific combination of copper's conductive properties with enhanced mechanical performance from tin and phosphorus is advantageous.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.040 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.4370 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 18.69 range 17.57–19.81median of 2 measurements | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -135.5 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1424 | eV/atom | — |