Cu4P10Sn1 is a copper-phosphorus-tin compound belonging to the semiconductor material family, likely investigated for its potential in electronic or optoelectronic applications. While this specific composition is not widely established in mainstream engineering literature, materials in the Cu-P-Sn system are of research interest for their electrical and thermal properties; they may serve specialized roles in device fabrication, contact metallurgy, or emerging semiconductor technologies where multi-element phosphide or tin-based compounds offer advantages over binary alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.1664 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1430 | eV/atom | — |