Cu3TeS3Cl is a quaternary copper tellurium sulfide halide compound, representing an experimental mixed-anion material that combines metallic copper with tellurium, sulfur, and chlorine. This compound belongs to the family of multinary chalcogenides and is primarily of research interest for its potential in functional materials applications, particularly where combined electronic and ionic transport properties might be exploited. Such materials are being investigated for thermoelectric conversion, solid-state ionics, and photovoltaic device components, though Cu3TeS3Cl remains largely in the development phase rather than established industrial use.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.590 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.8480 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 15.01 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij)2 entries | 0.1184 | C/m² | — | ||
| ↳ | 0.4155 | C/m² | — | ||
Piezoelectric Stress Tensor(eij) | Matrix (redacted) | C/m² | — | ||
Seebeck Coefficient(S) | -325.2 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02560 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2694 | eV/atom | — |