Cu3Sn
metal· Cu3Sn
Cu3Sn is an intermetallic compound in the copper-tin system, representing a stoichiometric phase commonly encountered in solder joints and bronze alloys. It is primarily significant in electronics manufacturing and metal joining applications, where it forms as a reaction layer at copper-tin interfaces during soldering or thermal aging. Engineers encounter this phase in lead-free solder systems and tin-plated copper interconnects, where its brittle character and propensity to grow over time make it an important consideration for long-term reliability and joint integrity.
solder joint metallurgylead-free electronics assemblyintermetallic growth in interconnectstin-copper coatingsthermal fatigue resistancemicroelectronics packaging
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 15,434.7 | ksi | — | ||
| ↳ | 15,625.5 | ksi | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.5541 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | ksi | — | ||
Poisson's Ratio(ν) | 0.3437 | - | — | ||
Shear Modulus(G)2 entries | 5,385.1 | ksi | — | ||
| ↳ | 5,728.9 | ksi | — |
N entriesMultiple entries per property — large groups are collapsed; click a summary row to expand. Use filters above to narrow by form / heat treatment / basis.
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3137 | lb/in³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 2.880 | µV/K | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1006 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.1078 | eV/atom | — | ||
| ↳ | 0.08949 | eV/atom | — |
N entriesMultiple entries per property — large groups are collapsed; click a summary row to expand. Use filters above to narrow by form / heat treatment / basis.
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.