Cu3Sn is an intermetallic compound in the copper-tin system, representing a stoichiometric phase commonly encountered in solder joints and bronze alloys. It is primarily significant in electronics manufacturing and metal joining applications, where it forms as a reaction layer at copper-tin interfaces during soldering or thermal aging. Engineers encounter this phase in lead-free solder systems and tin-plated copper interconnects, where its brittle character and propensity to grow over time make it an important consideration for long-term reliability and joint integrity.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 106.4 | GPa | — | ||
| ↳ | 107.7 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.5541 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν) | 0.3437 | - | — | ||
Shear Modulus(G)2 entries | 37.13 | GPa | — | ||
| ↳ | 39.50 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.684 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 2.880 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1006 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.1078 | eV/atom | — | ||
| ↳ | 0.08949 | eV/atom | — |