Cu3PdAu4 is a ternary intermetallic compound combining copper, palladium, and gold in a fixed stoichiometric ratio. This material belongs to the precious-metal alloy family and is primarily of research and specialized industrial interest rather than a commodity engineering material. Its applications leverage the corrosion resistance of precious metals, biocompatibility of gold and palladium, and potential catalytic or electronic properties arising from its ordered crystal structure.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 14.68 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.08648 | eV/atom | — |