Cu3Pd is an intermetallic compound in the copper-palladium system, combining the ductility and electrical properties of copper with the corrosion resistance and catalytic potential of palladium. This material is primarily investigated in research and specialized industrial contexts for applications requiring both noble-metal durability and copper's thermal or electrical conductivity, including catalysis, hydrogen storage research, and advanced coating systems. Its ordered crystal structure makes it stiffer and more brittle than pure copper, positioning it as a candidate for high-performance alloys where corrosion resistance and strength are prioritized over formability.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 21,230.2 | ksi | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 1.473 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | ksi | — | ||
Poisson's Ratio(ν) | 0.3555 | - | — | ||
Shear Modulus(G) | 6,787.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3458 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00200 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.07880 | eV/atom | — | ||
| ↳ | -0.1011 | eV/atom | — |