Cu3P2O8 is an inorganic ceramic compound belonging to the phosphate ceramic family, combining copper with phosphorus and oxygen in a stable crystalline structure. This material is primarily of research and development interest for applications requiring copper-containing ceramics with moderate stiffness and density characteristics. Industrial adoption remains limited, but the copper-phosphate family shows promise in electrochemistry, thermal management systems, and specialized catalytic applications where copper's electronic properties can be leveraged within a ceramic matrix.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 12,511 | ksi | — | ||
Poisson's Ratio(ν) | 0.2600 | - | — | ||
Shear Modulus(G) | 6,974.9 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1569 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00300 | eV | — | ||
Magnetic Moment(μB) | 0.9850 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -1.539 | eV/atom | — |