Cu3Os is an intermetallic compound combining copper and osmium, belonging to the family of high-density metal compounds. This material is primarily of research and development interest rather than established commercial use, as it combines the thermal and electrical properties of copper with the exceptional hardness and corrosion resistance of osmium. Cu3Os and related copper-osmium intermetallics are investigated for specialized applications requiring extreme hardness, wear resistance, and chemical inertness in demanding environments where conventional alloys fall short.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.4544 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.3912 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.3912 | eV/atom | — |