Cu3N is a copper nitride intermetallic compound that combines metallic and ceramic characteristics, representing an emerging material in the transition metal nitride family. While primarily investigated in research settings rather than established industrial production, Cu3N and related copper nitrides are being explored for applications requiring hardness, wear resistance, and electrical conductivity—particularly in thin-film coatings and functional materials where conventional copper alloys fall short. Its potential relevance lies in emerging technologies such as hard coatings, catalytic applications, and nanostructured materials, where the combination of copper's conductivity with nitrogen's strengthening effects offers advantages over pure copper or traditional copper alloys.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 16,930.3 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.3500 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 7,069.1 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2400 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.3610 | eV | DFT · OptB88vdW | ||
| ↳ | 0.3390 | eV | DFT · TBmBJ | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 12.80 | - | DFT · OptB88vdW | ||
| ↳ | 11.71 | - | DFT · TBmBJ | ||
Electron Effective Mass(m*e) | 0.05000 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 0.06000 | me | DFT · OptB88vdW · 27°C | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 7.120 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.5686 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.5647 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data