Cu3Ag is a copper-silver intermetallic compound that combines the thermal and electrical conductivity advantages of copper with silver's enhanced corrosion resistance and antimicrobial properties. This material is investigated primarily in research contexts for specialized applications where both high electrical performance and superior surface durability are critical, positioning it as an alternative to pure copper or traditional copper alloys in demanding environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 18,332.8 | ksi | — | ||
Poisson's Ratio(ν) | 0.3700 | - | — | ||
Shear Modulus(G) | 6,045.2 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3367 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.06830 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.06828 | eV/atom | — |