Cu3 Sn1

semiconductor

· Cu3 Sn1

Cu3Sn1 is an intermetallic compound in the copper-tin system, representing a stoichiometric phase that forms at specific compositions and temperatures. This material belongs to the family of copper-tin intermetallics, which have been studied extensively in metallurgy and materials science due to their relevance to solder joints, bronze alloys, and electronic interconnections. Cu3Sn is particularly notable as a brittle intermetallic that forms at the interface between copper and tin-based solders, making it important to understand for controlling joint reliability in electronic assembly and preventing failure modes like tin whisker formation and thermal fatigue.

solder joint reliabilityelectronic interconnectstin-copper phase studiesthermal cycling resistanceresearch/metallurgical analysismicrostructure control in electronics

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00420	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.08900	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu3 Sn1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control