Cu₃Pt₁ is an intermetallic compound combining copper and platinum in a 3:1 stoichiometric ratio, belonging to the ordered metallic compound family. This material is primarily of research and experimental interest rather than established production use, studied for its potential in high-temperature applications, catalysis, and electronic devices where the combination of copper's thermal conductivity with platinum's chemical stability and electronic properties offers theoretical advantages.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00300 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1370 | eV/atom | — |