Cu3 Au1

semiconductor

· Cu3 Au1

Cu3Au1 is an intermetallic compound belonging to the copper-gold system, characterized by a 3:1 copper-to-gold atomic ratio and ordered crystalline structure. This material is primarily of research and specialized industrial interest rather than mainstream engineering use, valued for its electrical and thermal properties in thin-film applications, jewelry alloys, and electronic interconnects where the combination of copper's conductivity and gold's corrosion resistance provides functional advantages. Cu3Au represents a model system for studying ordering phenomena and phase behavior in metallic systems, making it notable in materials science research alongside limited commercial applications in high-reliability electronics and decorative alloys.

electronic interconnects and bondingthin-film research applicationshigh-reliability contactsjewelry and decorative alloysintermetallic phase studiescorrosion-resistant coatings

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000600	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.03900	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu3 Au1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control