Cu2H3ClO3 is a copper-based inorganic compound classified as a ceramic material, likely a mixed-valence copper hydroxychloride oxide system. This compound appears to be a research or specialty material rather than a commodity ceramic, with potential applications in catalysis, antimicrobial coatings, or electronic applications where copper's redox properties are valuable. Its mixed anionic composition (hydroxyl, chloride, and oxide groups) suggests relevance to aqueous-based processing environments where corrosion resistance or selective reactivity is needed.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 44.53 | GPa | — | ||
Poisson's Ratio(ν) | 0.3000 | - | — | ||
Shear Modulus(G) | 20.66 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.523 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.07900 | eV | — | ||
Magnetic Moment(μB) | 0.05100 | µB | — | ||
Seebeck Coefficient(S) | 80.20 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03120 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.7988 | eV/atom | — |