Cu2 Pd1 Au1

semiconductor

· Cu2 Pd1 Au1

Cu₂PdAu is an intermetallic compound combining copper, palladium, and gold in a 2:1:1 ratio, representing a ternary noble-metal alloy system. This material exists primarily in research and development contexts, where it is studied for applications requiring simultaneous thermal stability, electrical conductivity, and corrosion resistance. The addition of gold to copper-palladium systems is typically explored for enhanced wear resistance and biocompatibility in specialized electronic, catalytic, or medical device applications where the cost of precious metals is justified by performance or biocompatibility requirements.

research/experimental phaseelectrical contactscatalytic applicationsbiomedical implantshigh-reliability connectorscorrosion-resistant coatings

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.02140	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1170	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu2 Pd1 Au1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control