Cu2 Ag6

semiconductor

· Cu2 Ag6

Cu₂Ag₆ is an intermetallic compound in the copper-silver system, representing a high-silver-content phase that combines the electrical and thermal conductivity of copper with silver's superior corrosion resistance and antimicrobial properties. This material is primarily of research and specialized industrial interest, appearing in advanced electronics, high-reliability electrical contacts, and brazing filler metals where the enhanced performance of silver-dominant compositions justifies the material cost over conventional copper or copper-silver alloys.

electrical contacts and switchingbrazing filler metalshigh-reliability electronicsantimicrobial coatingsresearch compounds

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00260	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.07300	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu2 Ag6

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control