Cu1 Zn2 Au1

semiconductor

· Cu1 Zn2 Au1

Cu₁Zn₂Au₁ is an experimental ternary intermetallic compound combining copper, zinc, and gold in a defined stoichiometric ratio. This material belongs to the family of noble metal-bearing intermetallics, which are of research interest for applications requiring corrosion resistance, wear resistance, and electrical properties beyond conventional brasses or bronzes. Limited industrial deployment exists; the compound is primarily studied in materials research contexts for high-reliability electronic contacts, specialty jewelry alloys, and corrosion-resistant coatings where the gold content provides nobility and the zinc-copper matrix offers structural stability.

electrical contacts and connectorscorrosion-resistant coatingsspecialty jewelry and decorative alloyswear-resistant intermetallicsexperimental/research applicationshigh-reliability electronics

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00310	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1330	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu1 Zn2 Au1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control