Cu1 Tc1 Bi1 — Properties & Data | MatWorld

Cu1 Tc1 Bi1

semiconductor

· Cu1 Tc1 Bi1

Cu1Tc1Bi1 is a ternary intermetallic compound combining copper, technetium, and bismuth in equiatomic proportions. This is a research-stage material studied in condensed matter physics and materials science; it is not in widespread commercial production. Intermetallic compounds in this compositional family are of theoretical interest for investigating electronic structure, crystal symmetry, and potential superconducting or strongly correlated electron behavior, though practical engineering applications remain largely exploratory.

fundamental materials researchsuperconductivity studiesintermetallic phase diagramscondensed matter physicselectronic structure investigation

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00580	eV	DFT · OptB88vdW

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.6940	eV/atom	DFT · OptB88vdW

Verified Unverified Low confidence (<80%) Link to source

Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu1 Tc1 Bi1

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control